Changsha Chixin Semiconductor Technology has closed an A+ round of more than 200 million yuan, a new high for a single financing in the physical-AI spatial-perception chip track. The round was led by Shanghai Yanpu Precision Technology Group, with Hunan Jinxia Shengshi Equity Fund, Shanghai Quectel Communications and Changsha Lushan Investment Holding Group joining.
The investors will work together on automotive-grade chip adoption, embodied-intelligence scenario deployment and a shared industry ecosystem, pushing domestic UWB chips into broader physical-AI spatial-perception use at scale.
Founded in June 2020 and headquartered in Hunan’s Xiangjiang New Area with a Shanghai research-and-development centre, Chixin builds high-precision spatial-perception technology on self-developed UWB chips, aiming to form the perception base for physical-world intelligence.
The core team covers analogue, radio-frequency, baseband, algorithm, protocol-stack software, application software and hardware in house. Its CX310 and CX500 series have reached mass production and ship to leading customers in consumer electronics, the internet of things and automotive electronics. Through this year the products have also penetrated smart homes, smart radar, intelligent new-energy power stations and new-energy vehicles.
Editor’s note: This is an adapted translation of the original Gasgoo report. It has been trimmed and restructured for readability for an international business audience. The full original (in Chinese) is at https://www.gasgoo.com/apps/50640d4b55d5cba175fb84f15d679f19/robot/news/70473025-seeds-%E9%A9%B0%E8%8A%AF%E5%8D%8A%E5%AF%BC%E4%BD%93%E5%AE%8C%E6%88%90%E8%B6%85%E4%B8%A4%E4%BA%BF%E5%85%83a-%E8%BD%AE%E8%9E%8D%E8%B5%84/.