Tencent’s Hunyuan Pre-Training Lead Joins Mira Murati’s Thinking Machines Lab

LeiPhone has learned exclusively that Yao Xingcheng, who led pre-training for Tencent’s Hunyuan large language model, has joined North American start-up Thinking Machines Lab. Tencent’s Hunyuan Pre-Training Lead Joins Mira Murati’s Thin (Source: LeiPhone) People familiar with the matter said Thinking Machines Lab offered Yao a package clearly above his Tencent income, which was already … Read more

Intel’s Physical-AI Play: One Chip for the Robot Brain and the Cerebellum

On 22 to 23 September, Intel held its ‘Same Core, Far Intelligence’ technology and ecosystem conference in Suzhou, putting the two main AI deployment lines on stage: industry AI, and physical AI for robots. Intel’s Physical-AI Play: One Chip for the Robot Brain and t (Source: OFweek Robotics) Wang Jingjia, general manager of Intel China’s … Read more

WRC 2026: China’s Robot Makers Ditch the Backflip and Start Asking If the Maths Works

Less than a month after WAIC in Shanghai, Beijing hosted WRC 2026. Nobody expected a model rewrite in a few weeks, so this field report reads the show against months of company performance to see where the ’embodied brain’ actually stands. WRC 2026: China’s Robot Makers Ditch the Backflip and Start (Source: LeiPhone) The clearest … Read more

PaXini Ships the First Mass-Produced True 6D Tactile Chip to Give Robots a Human Sense of Touch

The answer to human touch was never the eyes or ears. It was the Pacinian corpuscle, a layered sensor deep under the skin that acts like a natural filter, ignoring gentle strokes and static pressure while responding to impact, sudden pressure change and high-frequency vibration. These receptors cluster in palms and soles, the points where … Read more

DeepSeek is betting RMB 18 billion on Huawei’s AI chips

A gigawatt bet on domestic silicon DeepSeek plans to build a large intelligent-compute centre in Ulanqab, Inner Mongolia, deploying at least 160,000 of Huawei’s next-generation Ascend 950DT chips. The order is worth about USD 2.56 billion. If completed it would rank among the largest domestic AI chip clusters ever assembled. The centre is planned at … Read more

Huawei’s RoboHarness lets a coding agent conduct the robot orchestra

Imagine a task: open the cupboard, find the blocks hidden inside, then build them into a bridge. For a person this is trivial, a few actions flowing together that a nursery-school child completes without effort. For a robot it cuts across completely different abilities: finding the blocks needs visual understanding and language following; opening the … Read more

NIO President Qin Lihong: The Range-Extender Dividend Is Fading, Pure-Electric Share Will Soon Pass 50 Per Cent

China’s car market in the first half of 2026 moved through pressure and upheaval at once. Domestic passenger-car registrations fell roughly 20 per cent year on year, even as nearly 500 new models hit the market. The supply-demand mismatch shrank the hot-selling window of any single model to almost nothing, and the average operating margin … Read more

Google launches Gemini 4 Argon with a one-million-token output ceiling

Google has released Gemini 4 Argon, a frontier model it positions for long, complex workflows in software engineering, legal and financial knowledge work, and cyber defence. Unlike its consumer launches, Argon will roll out in stages, reaching trusted cyber-defence partners first through the Fairwind Program. The headline change is the output ceiling. Argon can generate … Read more

Qualcomm’s 2nm Dual Flagships Arrive, Rebuilt for the Agentic AI Era, Phones Now Run 30-Billion-Parameter Models

At the Snapdragon Summit 2026 in Maui on 22 September, Qualcomm launched two flagships on a 2 nm process, the sixth-generation Snapdragon 8 Elite Supreme and the sixth-generation Snapdragon 8 Elite, the first time the Snapdragon line has used 2 nm and the first time two Elite platforms arrived together. Qualcomm’s 2nm Snapdragon 8 Elite … Read more

Huawei Ships the World’s First 3D Data Centre, Stacking Power and Cooling Vertically to Break the AI Compute Bottleneck

On 22 September Huawei released what it calls the world’s first 3D data centre, reshaping AI data-centre infrastructure by stacking functions vertically instead of spreading them horizontally, decoupling cooling, power, backup and IT equipment to break the space, power and heat bottlenecks of the AI compute era. Huawei’s vertically stacked 3D data centre. (Source: Zhidx) … Read more