China’s first automotive-chip certification standards

China has published the world’s first national-level capability-evaluation system covering the full automotive-chip chain. The State Administration for Market Regulation, through the certification and accreditation body CNCA, approved and released five certification and accreditation industry standards that build a structured framework for assessing institutions across the automotive semiconductor sector. China releases the first certification standards … Read more

SiEngine’s ‘Tiangong 100’ 7nm AI chip enters mass production

On 12 August, SiEngine announced that its self-developed 7-nanometre automotive-grade AI accelerator, the Tiangong 100 (NNA100), has entered full mass production and begun batch supply to OEMs and Tier-1 partners. The chip is a standalone, plug-in accelerator for on-device agent AI, built to give local large models a complete domestic compute base and fix the … Read more

RoboSense unveils Eocene architecture and 2,160-line LiDAR

On 21 April 2026, RoboSense held its Tech Day in Shenzhen and for the first time laid out a systematic chip roadmap. Two flagship SPAD-SoCs on its new “Genesis” digital architecture debuted: the Phoenix line for monolithic native ultra-high line count, and the Peacock line for all-solid-state high-resolution arrays. Both reach mass production in 2026. … Read more

Moore Threads revenue doubles in six months as it prepares a Hong Kong secondary listing

Moore Threads, the Chinese GPU designer that listed on Shanghai’s STAR Market in December 2025, plans a secondary offering in Hong Kong less than a year later. The company disclosed the plan alongside first-half results showing revenue of 1.736 billion yuan, up 147 per cent year on year. Moore Threads is pitching its KUAE ten-thousand-card … Read more