Helium, naphtha, photoresist: the three soft spots in a chip fab
Why helium is the acute risk In front-end processing, steps including cleaning, film deposition, lithography, dry etching and inspection repeat 50 to 100 times or more per silicon wafer, sometimes over 1,000 steps in total. Helium and naphtha are the two materials a fab cannot do without. In dry etching, intense heat passes from plasma … Read more