They are all called 3D chips, but three different businesses hide under the label
A new wave of chip funding is clustering under one label, “3D stacking”, but the companies behind it are solving three different problems. Near-memory computing, compute-in-memory and 3D near-memory sound alike and some have raised about 1 billion yuan across two rounds, yet their markets and proof points diverge. The first route recombines logic chiplets, … Read more