Semiconductors

Jieluo Intelligent breaks ground on 1.2 billion yuan AMR base in Suzhou, targeting 2,000 robots a year

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Recently, Jieluo Intelligent Equipment (Suzhou) held a groundbreaking for its headquarters project in Wuzhong district. The site covers 42.5 mu, about 2.8 hectares, with roughly 70,000 square metres of floor area and total investment of 1.2 billion yuan. It will build a headquarters base producing 2,000 trackless-navigation robots, known as AMRs, and 500 wafer smart-storage … Read more

Qianhe Yibang raises 2 billion yuan for 3D memory chips

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Qianhe Yibang, a pioneer in 3D compute-in-memory chips, has closed a Series B of over 2 billion yuan. The round gathered a heavyweight mix of state capital and financial investors, including the national structural-adjustment fund, China Mobile’s chain-leader fund, Sequoia-sister vehicles, Hillhouse-linked and other first-tier institutions. NetEase Youdao and China Mobile’s chain-leader fund, long-term shareholders … Read more

Sunzhan: the RISC-V chip-design Copilot

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Sunzhan, founded in 2022 and still around twenty people, builds custom RISC-V processor cores (CPU, DSP, NPU) for domain-specific architectures. Founder Zeng Yi argues that AI has moved the decision over chip architecture out of the chip company and into the AI company: the model now dictates the silicon, and RISC-V’s freedom to add custom … Read more

China’s first automotive-chip certification standards

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China has published the world’s first national-level capability-evaluation system covering the full automotive-chip chain. The State Administration for Market Regulation, through the certification and accreditation body CNCA, approved and released five certification and accreditation industry standards that build a structured framework for assessing institutions across the automotive semiconductor sector. China releases the first certification standards … Read more

SiEngine’s ‘Tiangong 100’ 7nm AI chip enters mass production

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On 12 August, SiEngine announced that its self-developed 7-nanometre automotive-grade AI accelerator, the Tiangong 100 (NNA100), has entered full mass production and begun batch supply to OEMs and Tier-1 partners. The chip is a standalone, plug-in accelerator for on-device agent AI, built to give local large models a complete domestic compute base and fix the … Read more

RoboSense unveils Eocene architecture and 2,160-line LiDAR

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On 21 April 2026, RoboSense held its Tech Day in Shenzhen and for the first time laid out a systematic chip roadmap. Two flagship SPAD-SoCs on its new “Genesis” digital architecture debuted: the Phoenix line for monolithic native ultra-high line count, and the Peacock line for all-solid-state high-resolution arrays. Both reach mass production in 2026. … Read more

Moore Threads revenue doubles in six months as it prepares a Hong Kong secondary listing

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Moore Threads, the Chinese GPU designer that listed on Shanghai’s STAR Market in December 2025, plans a secondary offering in Hong Kong less than a year later. The company disclosed the plan alongside first-half results showing revenue of 1.736 billion yuan, up 147 per cent year on year. Moore Threads is pitching its KUAE ten-thousand-card … Read more