Xiaomi-backed 3D compute-in-memory AI chip firm Weina Hexin raises RMB 1 billion, nearing mass production
Zhidx reported on 9 September that Hangzhou three-dimensional compute-in-memory AI chip firm Weina Hexin has closed a RMB 1 billion C1 round and will soon reach scaled commercialisation and mass production, joining the first group of three-dimensional compute-in-memory AI chip companies worldwide to do so. Weina Hexin 3D compute-in-memory AI inference chip. (Source: Zhidx) The … Read more